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AMD Unveils Next-Generation AI Chip MI455 with Advanced Manufacturing and Packaging at CES

The introduction of AMD's next-generation AI chip, the MI455, highlights advancements in...
Key Metrics

11.79

Heat Index
  • Impact Level
    Medium
  • Scope Level
    Global
  • Last Update
    2026-01-06
Key Impacts
Positive Impacts (12)
Taiwan Semiconductor Manufacturing Co. (TSMC)
Advanced Micro Devices (AMD)
ASML Holding
Semiconductor Equipment Sector (Applied Materials, Lam Research, KLA, etc.)
OSAT / Advanced Packaging Firms (ASE Technology, Amkor)
SK Hynix
Negative Impacts (1)
NVIDIA Corp.
Total impacts: 14 | Positive: 12 | Negative: 1
Event Overview

The introduction of AMD's next-generation AI chip, the MI455, highlights advancements in manufacturing and packaging. The chip integrates HBM4 memory and EPYC CPUs, enabling large AI clusters through a new Helios rack design. Ongoing development includes the MI500 series, set for 2027 release, showcasing continued innovation in AI hardware.

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AMD Announces Next-Generation AI Chip MI455 with Advanced Manufacturing and Packaging
2026-01-06 11:43

At CES, AMD CEO Lisa Su announced that the next-generation AI chip, the MI455 GPU, will be manufactured using 2-nanometer and 3-nanometer processes and will feature advanced packaging technology. The MI455 GPU will be equipped with HBM4 memory and will be integrated with EPYC CPUs. A new Helios rack will contain 72 GPUs, and by connecting multiple racks, large AI clusters can be built. Additionally, AMD is developing the MI500 series chips, which are expected to be launched in 2027, using a 2-nanometer process. The goal is to increase AI performance by 1000 times within four years.

Total records: 1
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