Key Metrics
13.35
Heat Index-
Impact LevelMedium
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Scope LevelGlobal
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Last Update2026-03-18
Key Impacts
Positive Impacts (11)
Negative Impacts (4)
Event Overview
The collaboration focuses on the development of AI infrastructure, involving advanced memory chips and manufacturing processes. The partnership aims to enhance performance and efficiency in AI accelerators and processors, indicating a strategic move towards leadership in the AI hardware market.
Collect Records
Samsung and AMD Expand Strategic Partnership in AI Infrastructure Memory Chips
Samsung Electronics and AMD have signed a memorandum of understanding to expand their strategic cooperation in the field of AI infrastructure memory chips. Samsung will supply next-generation HBM4 memory for AMD's Instinct MI455X AI accelerator and provide optimized DDR5 memory for the 6th generation EPYC processors. Additionally, both companies will explore the possibility of Samsung providing foundry services to AMD.
AMD Announces Next-Generation AI Chip MI455 with Advanced Manufacturing and Packaging
At CES, AMD CEO Lisa Su announced that the next-generation AI chip, the MI455 GPU, will be manufactured using 2-nanometer and 3-nanometer processes and will feature advanced packaging technology. The MI455 GPU will be equipped with HBM4 memory and will be integrated with EPYC CPUs. A new Helios rack will contain 72 GPUs, and by connecting multiple racks, large AI clusters can be built. Additionally, AMD is developing the MI500 series chips, which are expected to be launched in 2027, using a 2-nanometer process. The goal is to increase AI performance by 1000 times within four years.